QP2000
Suitable for automatic probe testing of wafers such as 6 and 8″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc. Automatic loading and unloading, Wafer ID reading. Fully automatic CCD visual needle positioning. High precision positioning platform. Support high temperature testing. Real time generation of Mapping display Bin. Universal GPIB, TTL, R-232 interfaces.
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High-Precision Positioning |
Modular Design |
Excellent Vibration Suppression and Temperature Control Performance |
Automated Testing Capability |
| Model | QP2000 |
| Product introduction |
Suitable for automatic probe testing of wafers such as 6 and 8″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc.
Automatic loading and unloading, Wafer ID reading. |
| Features |
• Fully automatic CCD visual needle positioning. • High-precision positioning platform. • Support normal high temperature testing. • Generate Mapping display Bin in real time. • Universal GPIB, TTL, R-232 interface. |
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中国广东省佛山市南海国家高新区新光源产业基地光明大道16号 |
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0757 83207313 (销售) |
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0757 83208786 (销售) |
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