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第三代

半导体测试家族

Third generation semiconductor testing family

首页产品中心 Prober Prober

分类

QP3000

Suitable for automatic probe testing of wafers such as 8 and 12″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc. Automatic loading and unloading, Wafer ID reading. Fully automatic CCD visual needle positioning. High precision positioning platform. Support high temperature testing. Real time generation of Mapping display Bin. Universal GPIB, TTL, R-232 interfaces.

Suspended power supply

Multiple sites in parallel

Multi-channel high precision

Supports multiple extensions

Model	QP3000
Product introduction	Suitable for automatic probe testing of wafers such as 8 and 12″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc. Automatic loading and unloading, Wafer ID reading.
Features	• Fully automatic CCD visual needle positioning. • High-precision positioning platform. • Support normal high temperature testing. • Generate Mapping display Bin in real time. • Universal GPIB, TTL, R-232 interface.

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